As chip geometries get infinitesimally small, IBM is looking to DNA to make the manufacture of future chips feasible.
On Monday, IBM researchers and collaborator Paul W.K. Rothemund, of the California Institute of Technology, announced an advancement of a method to arrange DNA origami structures on surfaces compatible with today's semiconductor manufacturing equipment.
Low concentrations of triangular DNA
origami bind to wide lines on a lithographically patterned surface.
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